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New Inspection Method of Soldering Region at Room Temperature for ITER TF Termination
https://repo.qst.go.jp/records/77702
https://repo.qst.go.jp/records/7770218702f0f-0cbe-4ff6-8254-414c8cc67d2a
| Item type | 学術雑誌論文 / Journal Article(1) | |||||
|---|---|---|---|---|---|---|
| 公開日 | 2019-11-25 | |||||
| タイトル | ||||||
| タイトル | New Inspection Method of Soldering Region at Room Temperature for ITER TF Termination | |||||
| 言語 | ||||||
| 言語 | eng | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
| 資源タイプ | journal article | |||||
| アクセス権 | ||||||
| アクセス権 | metadata only access | |||||
| アクセス権URI | http://purl.org/coar/access_right/c_14cb | |||||
| 著者 |
Kajitani, Hideki
× Kajitani, Hideki× Nakamoto, Mio× Kasai, Yuma× Yamane, Minoru× Matsui, Kunihiro× Koizumi, Norikiyo× Hideki, Kajitani× Mio, Nakamoto× Yuma, Kasai× Minoru, Yamane× Kunihiro, Matsui× Norikiyo, Koizumi |
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| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | For inter-double-pancake joints of ITER TF it is required to achieve sufficiently low joint resistance (R-J), as 3 n Omega, to reduce Joule heating during operation with a background field of 2 T and nominal current of 68 kA. If R-J value is measured directly, a large cryostat is required to cool down the TF coil with huge mass and size during R-J measurement at 4 K. As alternative, authors have developed new inspection methods to obtain R-J value. The contributions to R-J can be divided mainly into contact resistance between the copper sole and cable (R-c) and resistance of soldered region between copper soles (R-sol). For the measurement of the former, the authors developed the inspection method in a past study. In this paper, the authors focus on the development of a measurement method for the latter. If there is a defect in the soldered region, a current distribution in the copper sole varies from the case of no defect, resulting in a change in the voltage profile along the copper sole. Thus, the voltage profile along the copper sole is measured at room temperature by supplying 20 A to the termination. To confirm the sensitivity to existence of a defect in soldered region, the measurements were performed for good (no-defect) and bad (defect) joints. An example of good joint was a joint sample the R-J value of which was sufficiently low, while had joint was simulated by artificially isolating a part of the soldered region. From the results of the measurements, a significant difference was observed between good and bad joint samples. Thus, it can be concluded that the developed method is practically effective for inspection of soldering quality between copper soles. | |||||
| 書誌情報 |
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY 巻 29, 号 5, p. 4200604, 発行日 2019-08 |
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| 出版者 | ||||||
| 出版者 | IEEE | |||||
| ISSN | ||||||
| 収録物識別子タイプ | ISSN | |||||
| 収録物識別子 | 1051-8223 | |||||
| DOI | ||||||
| 識別子タイプ | DOI | |||||
| 関連識別子 | 10.1109/TASC.2019.2899661 | |||||
| 関連サイト | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | https://ieeexplore.ieee.org/document/8642920/authors#authors | |||||
