@article{oai:repo.qst.go.jp:00077702,
 author = {Kajitani, Hideki and Nakamoto, Mio and Kasai, Yuma and Yamane, Minoru and Matsui, Kunihiro and Koizumi, Norikiyo and Hideki, Kajitani and Mio, Nakamoto and Yuma, Kasai and Minoru, Yamane and Kunihiro, Matsui and Norikiyo, Koizumi},
 issue = {5},
 journal = {IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY},
 month = {Aug},
 note = {For inter-double-pancake joints of ITER TF it is required to achieve sufficiently low joint resistance (R-J), as 3 n Omega, to reduce Joule heating during operation with a background field of 2 T and nominal current of 68 kA. If R-J value is measured directly, a large cryostat is required to cool down the TF coil with huge mass and size during R-J measurement at 4 K. As alternative, authors have developed new inspection methods to obtain R-J value. The contributions to R-J can be divided mainly into contact resistance between the copper sole and cable (R-c) and resistance of soldered region between copper soles (R-sol). For the measurement of the former, the authors developed the inspection method in a past study. In this paper, the authors focus on the development of a measurement method for the latter. If there is a defect in the soldered region, a current distribution in the copper sole varies from the case of no defect, resulting in a change in the voltage profile along the copper sole. Thus, the voltage profile along the copper sole is measured at room temperature by supplying 20 A to the termination. To confirm the sensitivity to existence of a defect in soldered region, the measurements were performed for good (no-defect) and bad (defect) joints. An example of good joint was a joint sample the R-J value of which was sufficiently low, while had joint was simulated by artificially isolating a part of the soldered region. From the results of the measurements, a significant difference was observed between good and bad joint samples. Thus, it can be concluded that the developed method is practically effective for inspection of soldering quality between copper soles.},
 title = {New Inspection Method of Soldering Region at Room Temperature for ITER TF Termination},
 volume = {29},
 year = {2019}
}