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Fabrication of Tungsten and Carbon Clad Plates by Sinter Bonding Methods for Divertor System Characterization

https://repo.qst.go.jp/records/72452
https://repo.qst.go.jp/records/72452
9faf15b7-2845-4a7a-960c-dc06dffcc1b6
Item type 会議発表用資料 / Presentation(1)
公開日 2017-09-20
タイトル
タイトル Fabrication of Tungsten and Carbon Clad Plates by Sinter Bonding Methods for Divertor System Characterization
言語
言語 eng
資源タイプ
資源タイプ識別子 http://purl.org/coar/resource_type/c_c94f
資源タイプ conference object
アクセス権
アクセス権 metadata only access
アクセス権URI http://purl.org/coar/access_right/c_14cb
著者 岸本, 弘立

× 岸本, 弘立

WEKO 713594

岸本, 弘立

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朝倉, 勇貴

× 朝倉, 勇貴

WEKO 713595

朝倉, 勇貴

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中里, 直史

× 中里, 直史

WEKO 713596

中里, 直史

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福本, 正勝

× 福本, 正勝

WEKO 713597

福本, 正勝

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福本 正勝

× 福本 正勝

WEKO 713598

en 福本 正勝

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内容記述タイプ Abstract
内容記述 Full tungsten divertor is employed for ITER, and the tungsten will be the most potential candidate for the surface material of plasma facing components in fusion reactor after DEMO. Because it will take some time to build ITER and to establish experiments, a satellite Tokamak JT-60SA will investigate many factors and issues relating to the fusion plasma and components. An important issue is the interaction of plasma and tungsten on the divertor surface. JT60SA has carbon fiber reinforced carbon composite (CFC) divertor with cassette system which is machinery to exchange the divertor. JT-60SA is expected to be able to investigate the interaction of tungsten on divertor and plasma. Because the transport capability of cassette is limited, the full tungsten divertor cannot be used for JT60SA. A clad plate of tungsten and CFC which will be lighter and have good thermal conductivity is a desirable option to establish the issue. Normally it is not easy to join the tungsten and carbon by a diffusion bonding. Present paper researches production methods of the W/CFC clad plates and investigates the mechanical, microstructural and thermal properties of them.
会議概要(会議名, 開催地, 会期, 主催者等)
内容記述タイプ Other
内容記述 13th International Symposium on Fusion Nuclear Technology
発表年月日
日付 2017-09-26
日付タイプ Issued
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