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Atomic and electronic structure of ZrO2 film on Si(100) grown by low temperature chemical vapor deposition

https://repo.qst.go.jp/records/2003304
https://repo.qst.go.jp/records/2003304
427cdc74-dc2b-4db9-a776-413a7469fd2a
アイテムタイプ 学術雑誌論文 / Journal Article(1)
公開日 2026-05-18
タイトル
タイトル Atomic and electronic structure of ZrO2 film on Si(100) grown by low temperature chemical vapor deposition
言語 en
言語
言語 eng
資源タイプ
資源タイプ識別子 http://purl.org/coar/resource_type/c_6501
資源タイプ journal article
著者 Entani Shiro

× Entani Shiro

Entani Shiro

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Shigeki Hattori

× Shigeki Hattori

Shigeki Hattori

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Mitsunori Honda

× Mitsunori Honda

Mitsunori Honda

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Kohda Makoto

× Kohda Makoto

Kohda Makoto

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Yamamoto Hiroki

× Yamamoto Hiroki

Yamamoto Hiroki

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内容記述タイプ Abstract
内容記述 The low-temperature chemical vapor deposition (CVD) of ZrO₂ films have attracted attention due to its potential for integration with a wide range of substrates and applications. In addition, understanding the atomic structure and electronic properties of CVD-grown ZrO₂ films is essential for predicting their physical and chemical behavior. In this study, we developed a custom-designed CVD apparatus and successfully synthesized a ZrO₂ film on a Si substrate at a substrate temperature of 150 °C using tetrakis(ethylmethylamino)zirconium as the precursor. A film thickness of approximately 1–2 nm was achieved after a 30-minute deposition process. Zr K-edge extended X-ray absorption fine structure (EXAFS) analysis revealed that the film exhibits a polycrystalline structure with a Zr–O bond length of 2.16 Å. The electronic structure of the film was investigated using Zr L₃-edge X-ray absorption near-edge structure (XANES), electron energy loss spectroscopy (EELS), and ultraviolet photoelectron spectroscopy (UPS). These measurements showed that the electronic properties of the CVD-grown ZrO₂ film, particularly the valence band structure, are broadly comparable to those of bulk ZrO₂. The results suggest that the ZrO₂ film synthesized by low-temperature CVD can be suitable for use in electronic and optical devices, especially where thermal constraints are a concern.
書誌情報 AIP advances

巻 16, 号 5, p. 055021-1--7, 発行日 2026-05
出版者
出版者 AIP Publishing
DOI
識別子タイプ DOI
関連識別子 10.1063/6.0005054
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