{"created":"2023-05-15T15:00:27.335647+00:00","id":82045,"links":{},"metadata":{"_buckets":{"deposit":"de0d163a-c073-414f-b071-7734870d2bfa"},"_deposit":{"created_by":1,"id":"82045","owners":[1],"pid":{"revision_id":0,"type":"depid","value":"82045"},"status":"published"},"_oai":{"id":"oai:repo.qst.go.jp:00082045","sets":["11"]},"author_link":["931204","931203"],"item_10004_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2021-03","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"331","bibliographicPageStart":"325","bibliographic_titles":[{"bibliographic_title":"UV・EB硬化技術の最新開発動向"}]}]},"item_10004_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"マイクロ流体チップは次世代診断技術の１つとして期待されるものの、代表的な素材であるポリジメチルシロキサン(PDMS)には疎水性でコンタミしやすい・実用的な接合方法がないという２つの欠点があり、診断分野での実用化に向け大きな課題となっていた。我々はPDMSを改質して欠点を克服するとともに、複数のチップを一括接合する量子ビーム技術を開発した。これにより様々な機能を集積して処理能力を従来の数倍～数10倍に引き上げる「3次元積層マイクロ流体デバイス」を実現したので、UV光・電子線利用技術の最新動向をまとめた専門書の中で紹介する。","subitem_description_type":"Abstract"}]},"item_10004_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"㈱シーエムシー出版"}]},"item_10004_relation_10":{"attribute_name":"ISBN","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"978-4-7813-1595-9","subitem_relation_type_select":"ISBN"}}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"metadata only access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_14cb"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"大山, 智子"}],"nameIdentifiers":[{"nameIdentifier":"931203","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Tomoko, Oyama","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"931204","nameIdentifierScheme":"WEKO"}]}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"量子ビーム一括接合による3次元積層マイクロ流体デバイスの実現","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"量子ビーム一括接合による3次元積層マイクロ流体デバイスの実現"}]},"item_type_id":"10004","owner":"1","path":["11"],"pubdate":{"attribute_name":"公開日","attribute_value":"2020-10-08"},"publish_date":"2020-10-08","publish_status":"0","recid":"82045","relation_version_is_last":true,"title":["量子ビーム一括接合による3次元積層マイクロ流体デバイスの実現"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2023-05-15T20:38:20.348723+00:00"}