@article{oai:repo.qst.go.jp:00076110,
 author = {6.F., Dong and J. Meschter, S. and Nozaki, S. and Ohshima, Takeshi and Makino, Takahiro and Cho, J. and Ohshima, Takeshi and Makino, Takahiro},
 journal = {Polymer Degradation and Stability},
 month = {May},
 note = {Tin whisker growth is a serious issue in electronics components since this may lead to short circuits and current leakage.  Polyurethane-based conformal coatings have been seen as an effective candidate to mitigate
the tin whisker growth. In order to clarify the effect of such coatings, this study exposed the tinplated copper coupons coated with i) moisture cured polyurethane (PU) and ii) dual UV/moisture cured polyurethane acrylate (PUA), for long-term (up to 5000 h) high-temperature and high-humidity (HTHH)
storage (85 C and 85%RH, respectively). After HTHH storage, micro-structural developments in the tin layer, coating degradation, tin surface reaction, and coating adhesion to tin surface were analyzed to compare the tin whisker mitigation behavior. In order to improve the coating adhesion, tin surface was
also treated with a silane adhesion promoter before coating was applied. Furthermore, the effect of electron beam irradiation was investigated as it degraded the coating properties and adhesion. The results indicate that maintaining good adhesion and suppressing the degradation of mechanical properties of conformal coatings during various environmental exposures are essential for enhanced tin whisker mitigation.},
 pages = {219--229},
 title = {Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings},
 volume = {166},
 year = {2019}
}