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Polyurethane-based conformal coatings have been seen as an effective candidate to mitigate\nthe tin whisker growth. In order to clarify the effect of such coatings, this study exposed the tinplated copper coupons coated with i) moisture cured polyurethane (PU) and ii) dual UV/moisture cured polyurethane acrylate (PUA), for long-term (up to 5000 h) high-temperature and high-humidity (HTHH)\nstorage (85 C and 85%RH, respectively). After HTHH storage, micro-structural developments in the tin layer, coating degradation, tin surface reaction, and coating adhesion to tin surface were analyzed to compare the tin whisker mitigation behavior. In order to improve the coating adhesion, tin surface was\nalso treated with a silane adhesion promoter before coating was applied. Furthermore, the effect of electron beam irradiation was investigated as it degraded the coating properties and adhesion. 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Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings
https://repo.qst.go.jp/records/76110
https://repo.qst.go.jp/records/76110b04108ef-7828-4379-9a48-81dec314c257
Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2019-06-27 | |||||
タイトル | ||||||
タイトル | Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
アクセス権 | ||||||
アクセス権 | metadata only access | |||||
アクセス権URI | http://purl.org/coar/access_right/c_14cb | |||||
著者 |
6.F., Dong
× 6.F., Dong× J. Meschter, S.× Nozaki, S.× Ohshima, Takeshi× Makino, Takahiro× Cho, J.× Ohshima, Takeshi× Makino, Takahiro |
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抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | Tin whisker growth is a serious issue in electronics components since this may lead to short circuits and current leakage. Polyurethane-based conformal coatings have been seen as an effective candidate to mitigate the tin whisker growth. In order to clarify the effect of such coatings, this study exposed the tinplated copper coupons coated with i) moisture cured polyurethane (PU) and ii) dual UV/moisture cured polyurethane acrylate (PUA), for long-term (up to 5000 h) high-temperature and high-humidity (HTHH) storage (85 C and 85%RH, respectively). After HTHH storage, micro-structural developments in the tin layer, coating degradation, tin surface reaction, and coating adhesion to tin surface were analyzed to compare the tin whisker mitigation behavior. In order to improve the coating adhesion, tin surface was also treated with a silane adhesion promoter before coating was applied. Furthermore, the effect of electron beam irradiation was investigated as it degraded the coating properties and adhesion. The results indicate that maintaining good adhesion and suppressing the degradation of mechanical properties of conformal coatings during various environmental exposures are essential for enhanced tin whisker mitigation. |
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書誌情報 |
Polymer Degradation and Stability 巻 166, p. 219-229, 発行日 2019-05 |
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出版者 | ||||||
出版者 | ELSEVIER | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 0141-3910 | |||||
DOI | ||||||
識別子タイプ | DOI | |||||
関連識別子 | 10.1016/j.polymdegradstab.2019.05.019 | |||||
関連サイト | ||||||
識別子タイプ | URI | |||||
関連識別子 | https://www.sciencedirect.com/science/article/pii/S0141391019301776 |